Akron, Ohio – December 8, 2025 – Ezurio, a global leader in connectivity and embedded computing, today announces the Nitrogen95 Connected System-on-Module (SOM) — a high-performance vision...
A Ready-to-Deploy HMI Platform with Powerful NXP Edge Processing
AKRON, Ohio, 29 October 2025 -- Ezurio, a global leader in wireless modules, SOMs, and IoT solutions, announces a strategic partnership with onceLabs, a U.S.-based Nordic Semiconductor...
Aurawave combines Cloud2GND engineering, Ezurio module performance, and Nordic's nRF5340 technology to accelerate LE Audio innovation.
14 August 2025 – Akron, Ohio – Ezurio, a global leader in connectivity, proudly announces the release and immediate availability of the BL54L15μ Series , a breakthrough Bluetooth® Low Energy...
Akron, Ohio – July 8, 2025 – Ezurio, a global leader in connectivity, today announces the appointment of Mark Pugerude as Chief Executive Officer (CEO), effective immediately. Pugerude succeeds...
Wi-Fi 6 with Bluetooth® LE 5.4 Connectivity for Low-Power Industrial IoT
Delivering Unmatched Connectivity, Performance and Support for Next-Generation IoT Solutions
Akron, Ohio – 11 June 2024 – Ezurio,(the new name for Laird Connectivity) a global leader in connectivity, today announces the Sona™ NX611 , the latest addition to their growing portfolio of...
Solutions built on TI SimpleLink CC3351 Wi-Fi IC & AM67 & AM62 Processors
The First Industrial Grade Wi-Fi/Bluetooth Module Based on MediaTek's Filogic 320 (MT7921) Wi-Fi 6 Chipset
MediaTek partnership delivers powerful IoT innovation for industrial and commercial applications