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Laird Connectivity Announces Fully Featured Wi-Fi 4 + Bluetooth 5.2 Combo Module Based on Latest Infineon AIROC™ CYW43439 Chipset
Akron, Ohio , October 26, 2021 – Global technology leader, Laird Connectivity, has announced the upcoming Sterling-LWB+ Wi-Fi 4 (802.11 b/g/n) and Bluetooth 5.2 module , the latest member of the...