BL54H20 Series - Multi-Core Bluetooth LE + 802.15.4 + NFC

Shipping samples today!

The newest entry in our Nordic Semiconductor based Bluetooth LE portfolio is by far the most advanced, most secure, and highest performing multi core MCU architecture wireless solution available anywhere. The BL54H20 series of robust, tiny modules feature the Nordic nRF54H20 SoC. It directly targets the highest-performance processing capabilities with double the application processing (vs. prior BL5340). 2x Cortex-M33 AND 2x RISC-V coprocessors each are optimised for particular workloads. We’ve also scaled up memory to 2MB non-volatile and 1MB RAM.  Featuring BT 5.4, capabilities include support for Bluetooth LE, LE Audio, Bluetooth Mesh, and 802.15.4 protocols including Thread and Matter. It’s further enhanced with state-of-the-art security, designed for PSA Certified level 3, and supports Secure Boot, Secure Firmware Update, Secure Storage, and integrated tamper sensors for physical security. The BL54H20 supports with flexible programming via Canvas Software Suite, Nordic SDK or Zephyr RTOS. 

The BL54H20 series brings out all nRF54H20 hardware features and capabilities including high speed USB access, CAN FD controller, 2 x I3C and 14bit ADC, up to +10 dBm transmit power, from 1.9V to 5.5V supply considerations, and a true industrial operating range of -40 to 105°C. 

Complete regulatory certifications enable faster time to market and reduced development risk, simplifying your next wireless design!

• Nordic nRF54H20 – 4.7xmm 4.3 WSCLP with 64 GPIOs available. 
• Antenna choice – integrated pre-certified Chip antenna or external antenna support via MHF4 connector – Integrates Ignion NANO NN02-101 chip antenna for radiated efficiency and optimal location flexibility 
• Small form factor: 13.5 x 10 x 1.8 mm 
• Development choice: Canvas Software Suite, Zephyr RTOS, or Nordic nRF Connect SDK 
• Firmware Over the Air (FOTA) via MCUboot and Zephyr
  
• Hostless operation – Multi Core MCU reduces BOM
• Fully featured development kits to jump start Bluetooth LE development