RM186-SM

Some of the internal SmartBASIC events are being shared between certain peripherals and hence limitations apply for certain combinations. On the RM186 the SmartBASIC implementation uses the same mechanism internally to trigger both LoRa TX and GPIO assign events.

Simplest workaround would be using GpioBindEvent() instead of GpioAssignEvent(). However, this comes with a slightly higher power consumption.

Another workaround would be clearing the GPIO assign event before triggering a LoRa TX event and vice versa. To ensure this, the following sequence would be needed:

• In your GpioAssignEvent() callback function disable the assign event with GpioUnassignEvent() and start a short one-shot timer (e.g. some 10msecs).
• In the callback of that timer trigger the LoRa TX.
• On completion of the LoRa TX (either successfully or failed or both, depends on your application) re-enable the GPIO assign event in e.g. one (or more) of the following callbacks: EVLORAMACSEQUENCECOMPLETE or EVLORAMACTXCOMPLETE or EVLORAMACRXCOMPLETE (maybe others could be used too, would depend on your application)

The shelf life statements are essentially to prevent mishandling of the product and not storing it properly. If the modules are still sealed in the package, stored at the proper temperature and have not been exposed to moisture they should be fine. However, when working with modules beyond their shelf life you MUST bake the modules before populating the them to your board. Failure to bake the modules could result in the yield rate dropping down lower than expectation due to popcorn or de-lamination on the modules. It is recommended that you follow IPC/JEDEC J-STD-033 which is the general standard for the handling, packing, shipping and use of moisture/reflow sensitive surface mount devices.

Our main concern is around the castellation/pads which solder the module to the board. It is imperative those pads do not get tarnished, as this would cause soldering issues. Humidity can affect solderability as well, as if there is any excess moisture in the solder on the module, during reflow of the module to the board, steam balls can essentially explode the solder and sometimes result in an open circuit (or possibly a short circuit).

As long as all of the moisture handling and temperature guidelines are being followed you will likely have no issues. It is further recommended that when you do the build with modules that have exceeded their shelf life that you start with a handful to perform a test run and do a final test to make sure all is working as expected. As long as there are no issues with the initial test run we would expect that you will not experience any problems.