Laird Updates Popular Line of Bluetooth Modules with v4.2 Connectivity!

Laird is pleased to introduce a new line of Bluetooth HCI modules for rapid enablement of Bluetooth technology into OEM devices. The new BT85x and BT860 Series of USB and UART HCI modules and adapter complement Laird's original BT8x0 series of Dual-Mode Bluetooth v4.0 modules. These next-gen solutions leverage the Cypress CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth and Bluetooth Low Energy support.

The BT850 and BT860 Series build on the success of the original BT8x0 line of modules, giving OEM customers more options and flexibility for using the enhanced throughputs and security benefits in the Bluetooth v4.2 specification to their end devices, shortening development time and providing enhanced throughput, security, and privacy. These modules present a Bluetooth standard HCI interface with native support for Windows, Linux and Android Bluetooth software stacks for operating system backed devices and are ideal when designers need both performance and minimum size.

Laird is at the forefront of deploying certified module solutions for any stage of Bluetooth development, which enables customers to better address the requirements of their specific application. The addition of Bluetooth 4.2 to Laird’s HCI module portfolio provides pin-to-pin compatible solutions with enhanced security, including AES-128, Diffie-Hellman pairing, and link layer privacy. This enables customers to easily develop smart, secure, and power-conscious devices for a greater number of IoT deployments or easily upgrade from original BT8x0 designs without any footprint, or hardware changes.

The BT850 and BT860 Series join Laird’s rapidly expanding portfolio of embedded wireless modules. Paired with comprehensive IoT product design and development capabilities from strategy through production, Laird is a trusted partner for customers looking to create wireless innovations quickly to succeed in the market.

Engineering samples of all BT850, BT851 and BT860 devices are now available. Modules and kits are expected to be commercially available in January 2018. A fully featured low-cost developer’s kit is available for prototyping, debug, and integration testing for each module variant.

Learn more about the BT85x and BT860 modules, here!