TiWi-uB1 Bluetooth Module

Yes, the module can be used with an external host. Ezurio (formerly Laird Connectivity) does not provide any out-of-the-box firmware for the module that will allow this mode of operation. There are some great starter examples provided by TI here: Using the CC254x with an external host

The TiWi-uB1 module can be used in conjunction with an external host processor or microcontroller, using the HCI command protocol over a UART or SPI interface.

The TiWi-uB1 module is certified with an on module PCB trace antenna. Additionally the module is also certified with the Ezurio 2.4 GHz Dipole and 2.4 GHz Waterproof Dipole antennas, used in conjunction with any of our U.FL to Reverse Polarity SMA cables. Note that the correct model of module needs to be ordered based on the antenna option being used (PCB Trace: 450-0103, Off Module: 450-0106). Consult the Antenna Design Guide for details on implementing the TiWi-uB1 module into your design with one of the above certified antenna options.

The TiWi-uB1 is a single mode Bluetooth Smart module, that supports Bluetooth Low Energy (BLE) only.

The TiWi-uB1 module is a System-On-Chip (SOC), that has an integrated microcontroller that can be used for application development.

A 32 kHz crystal is required in applications that use power savings, to maintain the connection timing required by BLE. If your application is line powered and does not use power savings, the timing is maintained by the 32 MHz crystal, and hence no 32 kHz crystal is required.

We recommend using de-ionized water. Additionally, we recommend avoiding any sonic vibration, heat, and pressure washing as well as any other soaps/chemicals.

The Manufacturer's Specific Data Type is used for manufacturer specific data which can be proprietary data structures defined by the manufacturer and only identifiable by manufacturer's equipment/applications. To use the Manufacturer's Specific Data Type you need to have a Company Identifier as assigned by the BT SIG. You must be a registered member of the BT SIG and must apply for the company identifier using the process below (found at this link: https://www.bluetooth.com/specifications/assigned-numbers/company-ident…)   Application & Assignment Process Submit the following below to  Bluetooth Support : Company information (legal name of company) Name of company's primary contact (name and email) A statement that your company is currently a Bluetooth SIG member in good standing* Please allow five business days for your request to be fulfilled, and two business days from the time your request is fulfilled to view your Company Identifier on this page. *  ? BLUETOOTH Member in Good Standing ? shall mean any firm, corporation or other legal entity that has been admitted to membership in the BLUETOOTH SIG, whether a Promoter Member, Associate Member or Adopter Member, as defined in the organizational documents, that has fulfilled all of the requirements for membership, has paid and is current with payment of any and all membership fees, dues and assessments, and whose membership neither has been voluntarily or involuntarily suspended, terminated, or withdrawn from membership consistent with the lawful provisions of the organizational documents of the BLUETOOTH SIG.?

The TiWi-BLE can be tested a couple of ways. Either with the TiWi WLAN Eval Tool or in Linux with the following weblink to guide on how to do that. The customer needs to read through our product documentation before going to the following Ti page: http://processors.wiki.ti.com/index.php/WL127x_TX_Testing

Before we suggest using the Ti link above, the module must be calibrated, those steps and instructions are in the Documentation section on the product page.

The difference between the two revisions (R1 and R2) is the label change located on the module itself. The hardware is exactly the same and will run the same firmware on both revisions.

The factors to confirm when checking the soldering job on Bluetooth modules are solder stencil aperture size, solder stencil thickness, solder ball size, solder type, and the MSL guidelines. If the parts have been left out for too long then the modules should be baked to remove any moisture prior to soldering. If there are any failures, we highly recommend providing an x-ray of the module.

Ezurio provides 3D files (STEP) files for most but not all of it's modules.  Based on the nature of the information in the files, in most cases Laird requires a login to access these files as well as layout files and software/firmware downloads.  As such, for most modules, the 3D files are found under the Software Downloads tab of the product page.  The page offers a credentials request link for customers who need credentials.  In most cases, the credentials are provided via return email within about 10 minutes. Please contact support if you have any additional questions or have any issues accessing our downloads.

We highly do not recommend conformal coating the radio module. If you plan on encapsulating the radio module in a potting compound or conformal coating, you must assure that the compound in liquid or solid form does not enter under the shield where there are sensitive RF components. Some of the capacitive and inductance values are as low (pF and nH) and could be sensitive to contacting materials such as potting compounds. There are potting compounds and conformal coatings which have very good dielectric constants and are suitable for 2.4 GHz potting applications, however, when you apply any of these, they were not accounted for in the circuit design and might reduce performance of the device (or all together cause it not to function).  You should run tests on their particular potting compound and evaluate radio's performance and range.  Also, it's worth mentioning that applying any compound, conformal coating or potting directly to the module WILL void the warranty. If your application requires 100% sealing of the radio module, there is a way to do this very successfully without impacting the module performance. Simply place the module on your PCB. Place a plastic cover over the module (like a hat), make the cover large enough to cover the whole module. Apply glue around the bottom perimeter of the cover where it sits on the PCB. This allows the module to function in free air-space while there is a complete seal around it. This information is only for reference and we recommend you should conduct your own testing with your prototype of your end application to find the best suitable fit for your design.  

We only recommend reflowing our modules once as it can damage the module and void the warranty.

The HostTestApp is an example included in the TI BLE Stack. It can be located at the link below. http://www.ti.com/tool/ble-stack Below is an app note that should help in the process as well. http://processors.wiki.ti.com/index.php/PTM_cc2640

Ezurio provides layout files PADS and PADS ASCII formats. The ASCII files will import to Altium (and Protel varients) as well as Cadence (Orcad and Allegro) CAD packages. As far as we know, there is no way to import to Eagle CAD. Please be sure to use the .asc file for PCB and the .txt file for the schematic when importing to Altium. Ezurio uses ORCAD for schematics (Gerbers). 

The recommended cleanser is "hydrocarbon cleaning oil", which can be used to clean the RF shield and PCB. We do not recommend the use of alcohol as it doesn't work as well and could leave residue on the boards.