Our customers asked for a high-performance, secure, and robust IoT SoM that’s rugged, simplifies their BOM, has reliable connectivity, and is globally certified. One with a proven security architecture, long term software support, security fixes, and device management.

Our new Summit SOM 8M Plus is powered by NXP’s innovative i.MX 8M Plus processor and 88W8997 wireless silicon coupled with onboard NXP PMICs (PCA9450CHN and PM823UK), performance LPDDR4 RAM, and eMMC 5.1 storage. We combine this with our long-term support Summit Yocto Linux and Zephyr RTOS, secure enclave, and Summit Linux FIPS Core Crypto to offer a comprehensive hardware and software solution throughout your product’s lifecycle.

  • Advanced DVK with reference designs for display, camera, audio, LTE, GPS, power consumption profiling, PoE, battery usage, battery charging, USB 3.0 power, and a Bluetooth 5.3 module integration supporting LE coded/Long Range
  • Secure Enclave for secure boot, secure credential, and secure data storage including Secure Manufacturing and Provisioning
  • Security and Software Life Cycle Maintenance: Long-term Support for Summit Yocto Linux and Zephyr RTOS with CVE notification and remediation on long term support versions that minimize the impact of changes and revisions
  • FIPS 140-3 Level 1 validation managed over the life of product​

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The Summit SOM 8M Plus leverages NXP's I.MX 8M Plus architecture into the most powerful platform for your IoT designs. The use cases are nearly endless, with powerful video, audio, virtualization, a wide array of interfaces, secure enclave and secure boot, brilliant power management, full lifecycle management, and much more. 

Powerful MPU/MCU

1.6 GHz 4-core Cortex-A53 MPU
800 MHz Cortex-M7 MCU

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Machine Learning

Up to 2.3 TOPS dedicated NPU
High-performance edge ML

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Endless Interfaces

Display/camera, network, audio
Extensive I/O peripheral support

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Heterogenous Multiprocessing

Run Linux and multiple RTOSes on dedicated cores

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10+ Year
Life Cycle

LTS SW availability, OTA updates
Upgrade path for future Wi-Fi/BT

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Camera, Video, and Encode/Decode

1200p60 or 4Kp30 (up to 3)
Multi-codec encode/decode

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Smart Power Management

PMICs, low-power RAM/storage
Many optimizations via 8M Plus

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Secure Enclave / Secure Boot

Dedicated on-board security HW
Signed images, encrypted creds

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Ezurio is honored to be approved as an NXP Gold Partner! We look forward to working with the NXP team to deliver the solutions our customers need in an ever changing wireless future. Please follow the link for more information.

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Manage every part of the security lifecycle.
Find the options you need in the Summit Suite range.

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Reduce design risk and accelerate your time to market with Ezurio's custom Single Board Computers (SBC). We offer: 

  • A hand-in-hand partnership approach.
  • Design your board your way.
  • Lower production costs by choosing your required components.
  • Industry leading hardware and software.

Learn More

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  • 453-00072-K1

    453-00072-K1

    Recommended for New Design (RND)
    Development Kit for Summit SOM 8M Plus (2 GB LPDDR4, 16 GB eMMC)
    Antenna Type
    External
    Description
    Development Kit for Summit SOM 8M Plus (2 GB LPDDR4, 16 GB eMMC)
    Learn More
  • 453-00135-K1

    453-00135-K1

    Recommended for New Design (RND)
    Development Kit for Summit SOM 8M Plus (4 GB LPDDR4, 32 GB eMMC)
    Antenna Type
    External
    Description
    Development Kit for Summit SOM 8M Plus (4 GB LPDDR4, 32 GB eMMC)
    Learn More
  • CAF94505

    CAF94505

    Nanoblade Series Internal Antenna
    Learn More
  • MAF95310

    MAF95310

    Mini NanoBlade Flex / Flex 6E Series Internal Antenna
    Learn More
  • EFD2455A3S-10MHF1

    EFD2455A3S-10MHF1

    FlexMIMO / FlexMIMO 6E MIMO Internal Antenna
    Learn More
  • 001-0016

    001-0016

    FlexPIFA / FlexPIFA 6E Flexible Adhesive-Backed PIFA Internal Antennas
    Learn More
Chipset (MPU)
4x Cortex®-A53 cores @ 1.6 GHz
(NXP I.MX 8M Plus)
Chipset (MCU)
1x Cortex®-M7 core @ 800 MHz
(NXP I.MX 8M Plus)
Wireless Specification
Wi-Fi 5 (802.11ac)
Bluetooth 5.3
Chipset (Wireless)
NXP 88W8997
Dimensions
40 x 47 x 4.6 mm
Antenna Options
2x U.FL connector
Certifications
FCC, ISED, CE, UKCA, MIC, AS/NZS
Chipset (Audio)
Tensilica® HiFi 4 DSP
Chipset (Graphics)
GC7000UL with 2 shaders for 3D and GC520L for 2D
Chipset (Machine Learning)
Neural Processing Unit (NPU) with 2.3 TOP/s
Frequency
Dual-band 2.4 GHz and 5 GHz
GPU Features
166 million triangles/sec
1.0 giga pixel/sec
16 GFLOPs 32-bit
OpenGL ES 1.1, 2.0, 3.0, OpenCL 1.2, Vulkan
2D acceleration
Interfaces - Audio
SPDIF input and output
Six external SAI modules supporting I2S, AC97, TDM, codec/DSP, and DSD interfaces
ASRC
eARC/ARC (HDMI)
8-channel PDM mic input
Interfaces - General
2x USB 3.0/2.0 Dual-Role with PHY
2x Gbit Ethernet with IEEE® 1588, AVB (One also supports TSN)
2x CAN/CAN FD
4x UART 5 Mbit/s
6x I2C
3x SPI
1x SDIO 3.0/eMMC 5.1
Interfaces - Video
Video Decode: 1080p60 HEVC/H.265 Main, Main 10 (up to level 5.1), 1080p60 VP9 Profile 0, 2, 1080p60 VP8, 1080p60 AVC/H.264 Baseline, Main, High decoder
Video Encode: 1080p60 AVC/H.264 encoder, 1080p60 HEVC/H.265 encoder
Machine Learning Features
Keyword detect, noise reduction, beamforming
Speech recognition (i.e. Deep Speech 2)
Image recognition (i.e. ResNet-50)
Memory
RAM - 512MB, 1GB, and 2GB; For other sizes please contact sales
Storage - 8GB and 16GB; For other sizes please contact sales
Temperature Range
-30° C to +85° C
Transmit Power (Max)
+18 dBm
Part Number
  • 453-00070C
  • 453-00070R
  • 453-00071C
  • 453-00071R
  • 453-00072C
  • 453-00072R
  • 453-00135C
  • 453-00135R
Price @ 1k
  • N/A
Antenna Type
  • External
Chipset (Wireless)
  • NXP 88W8997
Description
  • Summit SOM 8M Plus (1 GB LPDDR4, 8 GB eMMC) Cut/Tape
  • Summit SOM 8M Plus (1 GB LPDDR4, 8 GB eMMC) Tape/Reel
  • Summit SOM 8M Plus (2 GB LPDDR4, 16 GB eMMC) Cut/Tape
  • Summit SOM 8M Plus (2 GB LPDDR4, 16 GB eMMC) Tape/Reel
  • Summit SOM 8M Plus (4 GB LPDDR4, 32 GB eMMC) Cut/Tape
  • Summit SOM 8M Plus (4 GB LPDDR4, 32 GB eMMC) Tape/Reel
  • Summit SOM 8M Plus (512 MB LPDDR4, 8 GB eMMC) Cut/Tape
  • Summit SOM 8M Plus (512 MB LPDDR4, 8 GB eMMC) Tape/Reel
Frequency Range (Max)
  • 2495 MHz
Frequency Range (Min)
  • 2400 MHz
Frequency Range 2 (Max)
  • 5825 MHz
Frequency Range 2 (Min)
  • 5150 MHz
Logical Interfaces
  • SPDIF, I2S, AC97, TDM, DSP, DSD, ASRC, eARC, ARC, PDM, USB, Ethernet, CAN, UART, I2C, SPI, SDIO,
OS/Software
  • Hostless
  • Linux
Packaging
  • Cut/Tape
  • Tape/Reel
Product Type
  • SOM
System Architecture
  • Hostless
Technology
  • 802.11ac, Bluetooth 5.3
453-00070C
453-00070C
Active
N/AExternal NXP 88W8997 Summit SOM 8M Plus (512 MB LPDDR4, 8 GB eMMC) Cut/Tape 2495 MHz2400 MHz5825 MHz5150 MHzSPDIF, I2S, AC97, TDM, DSP, DSD, ASRC, eARC, ARC, PDM, USB, Ethernet, CAN, UART, I2C, SPI, SDIO, Linux Cut/Tape SOM Hostless 802.11ac, Bluetooth 5.3
453-00070R
453-00070R
Active
N/AExternal NXP 88W8997 Summit SOM 8M Plus (512 MB LPDDR4, 8 GB eMMC) Tape/Reel 2495 MHz2400 MHz5825 MHz5150 MHzSPDIF, I2S, AC97, TDM, DSP, DSD, ASRC, eARC, ARC, PDM, USB, Ethernet, CAN, UART, I2C, SPI, SDIO, Linux Tape/Reel SOM Hostless 802.11ac, Bluetooth 5.3
453-00071C
453-00071C
Active
N/AExternal NXP 88W8997 Summit SOM 8M Plus (1 GB LPDDR4, 8 GB eMMC) Cut/Tape 2495 MHz2400 MHz5825 MHz5150 MHzSPDIF, I2S, AC97, TDM, DSP, DSD, ASRC, eARC, ARC, PDM, USB, Ethernet, CAN, UART, I2C, SPI, SDIO, Linux Cut/Tape SOM Hostless 802.11ac, Bluetooth 5.3
453-00071R
453-00071R
Active
N/AExternal NXP 88W8997 Summit SOM 8M Plus (1 GB LPDDR4, 8 GB eMMC) Tape/Reel 2495 MHz2400 MHz5825 MHz5150 MHzSPDIF, I2S, AC97, TDM, DSP, DSD, ASRC, eARC, ARC, PDM, USB, Ethernet, CAN, UART, I2C, SPI, SDIO, Linux Tape/Reel SOM Hostless 802.11ac, Bluetooth 5.3
453-00072C
453-00072C
Active
N/AExternal NXP 88W8997 Summit SOM 8M Plus (2 GB LPDDR4, 16 GB eMMC) Cut/Tape 2495 MHz2400 MHz5825 MHz5150 MHzSPDIF, I2S, AC97, TDM, DSP, DSD, ASRC, eARC, ARC, PDM, USB, Ethernet, CAN, UART, I2C, SPI, SDIO, Hostless Cut/Tape SOM Hostless 802.11ac, Bluetooth 5.3
453-00072R
453-00072R
Active
N/AExternal NXP 88W8997 Summit SOM 8M Plus (2 GB LPDDR4, 16 GB eMMC) Tape/Reel 2495 MHz2400 MHz5825 MHz5150 MHzSPDIF, I2S, AC97, TDM, DSP, DSD, ASRC, eARC, ARC, PDM, USB, Ethernet, CAN, UART, I2C, SPI, SDIO, Hostless Tape/Reel SOM Hostless 802.11ac, Bluetooth 5.3
453-00135C
453-00135C
Active
N/AExternal NXP 88W8997 Summit SOM 8M Plus (4 GB LPDDR4, 32 GB eMMC) Cut/Tape 2495 MHz2400 MHz5825 MHz5150 MHzSPDIF, I2S, AC97, TDM, DSP, DSD, ASRC, eARC, ARC, PDM, USB, Ethernet, CAN, UART, I2C, SPI, SDIO, Linux Cut/Tape SOM Hostless 802.11ac, Bluetooth 5.3
453-00135R
453-00135R
Active
N/AExternal NXP 88W8997 Summit SOM 8M Plus (4 GB LPDDR4, 32 GB eMMC) Tape/Reel 2495 MHz2400 MHz5825 MHz5150 MHzSPDIF, I2S, AC97, TDM, DSP, DSD, ASRC, eARC, ARC, PDM, USB, Ethernet, CAN, UART, I2C, SPI, SDIO, Linux Tape/Reel SOM Hostless 802.11ac, Bluetooth 5.3

Product Brief 1 total

Name
Part
Last Updated
Product Brief - Summit SOM 8M Plus All 02/24/2025

Datasheet 1 total

Name
Part
Last Updated
Datasheet - Summit SOM 8M Plus All 02/24/2025

Software 1 total

Name
Part
Last Updated
Release Packages - Summit SOM 8M Plus All 06/30/2022

Documentation 2 total

Name
Part
Last Updated
PCN 8A-2023 - Summit SOM 8M Plus All 08/25/2023
User Guide - Summit SOM 8M Plus DVK All 06/29/2022

Technical Drawings 3 total

How can I bring up a softAP on the IG60/SOM60 automatically while simultaneously being connected as a station to a router?

Should I use Adaptive World Mode when hosting an AP?

Is there a Ezurio Wifi module that supports 4ADDR mode and layer2 bridging?

How can I measure the power consumption on my SOM 8M Plus Development Kit?

On Lairds SOM 8M Plus System on Module, how is the radio connected to the host processor?

What is the MCS index for Wi-Fi?

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  • Embedded RF hardware / firmware design
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  • Mobile application development
  • Product & Industrial Design

Talk to an Expert

Distributors

Distributor Phone Number Region Website
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+44 2039 365486
APAC, North America, South America, EMEA Website
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+44 1628 512900
APAC, North America, South America, EMEA Website
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+64 9 477 2148
APAC Website
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North America Website
DigiKey 1-800-344-4539
North America, South America, APAC, EMEA Website
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APAC Website
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+44 3447 11 11 22
EMEA Website
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1-514-428-8470
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EMEA Website
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EMEA Website
Jetronic China, Hong Kong and Taiwan 852-27636806 
APAC Website
Laird Connectivity 1-847-839-6925
+44 1628 858941
North America, South America, APAC, EMEA Website
M2M Germany +49-6081-587386-0
EMEA Website
Martinsson +46 8 7440300
EMEA Website
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APAC Website
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+44 1494 427500
North America, South America, APAC, EMEA Website
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+44 3457-201201
North America, South America, APAC, EMEA Website
Ryoyo Japan +81-3-3543-7711
APAC Website
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WPG +44 1628 958460
EMEA Website